ALINC TAIWAN CO., LTD.

KIT

This compact production platform incorporates our proprietary RAS (Radical Assisted Sputtering) technology. By utilizing radical-assisted sputtering, the system enables the low-temperature deposition of high-quality optical thin films with excellent wavelength uniformity and outstanding process repeatability. It is also suitable for depositing a wide range of functional thin films, including decorative coatings and nitride films.

Shincron, a leading manufacturer of vacuum coating production equipment in Japan, is renowned for its high-precision deposition technologies. The MIC1350 Series High-Precision Ion-Assisted Optical Coating System is designed for the deposition of AR (Anti-Reflection), DBR (Distributed Bragg Reflector), and ODR (Omnidirectional Reflector) coatings. The system is widely used in the production of optical components, LEDs, touch panels, and solar cell applications.

The PICOSUN™ Atomic Layer Deposition (ALD) System is optimized for research, production, process development, and pilot manufacturing applications. Its versatile reactor design enables high-quality thin-film deposition on wafers ranging from 2 to 18 inches (50 mm to 450 mm), as well as on three-dimensional structures and porous substrates. The reactor chamber is constructed from corrosion-resistant process materials to ensure long-term reliability and process stability. The system can be further upgraded with a wide range of accessories, including various precursor sources, interchangeable reactor chambers, manual or automated substrate loading systems, and ozone, nitrogen, or plasma generators to meet diverse application requirements.

Utilizing femtosecond laser technology and advanced laser cutting processes, the system generates an ultra-low heat-affected zone (HAZ), significantly reducing sidewall stress and microcracks in brittle materials and miniature optical components. It enables precision cutting of circular, non-circular, and rectangular geometries while delivering exceptional sidewall verticality and ultra-smooth surface finishes, providing outstanding laser cutting performance for demanding applications.

The iTS-LRW210 is equipped with RS-232C, RS-485, and Ethernet interfaces. Featuring a dedicated dual-CPU communication architecture, the system supports SECS communication and includes a built-in SECS-over-Ethernet communication function for seamless integration with semiconductor manufacturing equipment.

The PICOSUN™ R-200 Standard Thermal Atomic Layer Deposition (ALD) System is optimized for research, production, process development, and pilot manufacturing applications. Its versatile reactor design supports wafer sizes from 2 to 18 inches (50 mm to 450 mm), as well as deposition on complex three-dimensional structures and porous substrates. The reactor chamber is constructed from corrosion-resistant process materials to ensure exceptional durability and long-term process stability. The system can be upgraded with a wide range of accessories, including various precursor sources, interchangeable reactor chambers, manual or automated substrate loading systems, and optional ozone, nitrogen, or plasma generators to meet diverse application requirements.

The PICOSUN™ P-300B 12-inch Wafer-Level Batch Atomic Layer Deposition (ALD) System is optimized for research, high-volume manufacturing, process development, and pilot production. Its versatile batch reactor platform supports wafer sizes from 2 to 18 inches (50 mm to 450 mm), enabling highly uniform thin-film deposition on multiple wafers simultaneously, as well as on three-dimensional structures and porous substrates. Constructed with corrosion-resistant process chamber materials, the system delivers exceptional process stability, durability, and repeatability. A comprehensive range of upgrade options—including multiple precursor sources, interchangeable reactor chambers, manual or automated substrate loading systems, and optional ozone, nitrogen, or plasma generators—provides outstanding flexibility for a wide variety of advanced ALD applications.